METHOD FOR MANUFACTURING A PLURALITY OF SEMICONDUCTOR CHIPS

摘要

Disclosed is a method for manufacturing a plurality of semiconductor chips using a semiconductor substrate which has a plurality of first regions and a plurality of second regions that are positioned between the first regions. The method includes: a) a step of forming, in the second regions, a plurality of thick board portions and a plurality of thin board portions which include the first regions, by partially etching the rear surfaces of the first regions; b) a step of processing the rear surfaces of the thin board portions, corresponding to the type of the semiconductor chips to be manufactured; and c) a step of cutting and separating the first regions one from the other by cutting the semiconductor substrate along the boundaries between both the sides of respective second regions and the first regions.