| 摘要 |
<p>Disclosed is a laminated wiring board (1), wherein a low-resistance silicon substrate (2) having a predetermined specific resistance and a high-resistance silicon substrate (4) having a specific resistance higher than the predetermined specific resistance are laminated with an insulating layer (3) therebetween. On the low-resistance silicon substrate (2), an electrical path part (6) surrounded by means of an annular groove (5) is provided, and on the rear surface (4b) of the high-resistance silicon substrate (4) and on the inner surface (11a) of a recessed part (11), a wiring film (13) electrically connected with the electrical path part (6) through an opening (8) in the insulating layer (3) is formed. Since the high-resistance silicon substrate (4) is provided with the wiring film (13), an optical semiconductor element (20) and an electronic circuit element (30) respectively having different numbers and positions of electrode pads on the front surface side and the rear surface side of the laminated wiring board (1) can be electrically connected.</p> |
