RELIABILITY TESTING SYSTEM OF BLADE IN SEMICONDUCTOR WAFER DICING EQUIPMENT

摘要

PURPOSE: A reliability test system and method for a cutting blade of semiconductor wafer dicing equipment is provided to test a cutting blade by applying minute vibration to the cutting blade and converting the reflected mechanical signal into an electric signal. CONSTITUTION: A reliability test system for a cutting blade of semiconductor wafer dicing equipment comprises a transmitter(10), a receiver(30), a controller(40), a signal generator(20), a detector(50), and a data analyzer(60). The transmitter is inputted with an electric signal corresponding to a vibration signal from the signal generator and applies vibration to a cutting blade. The receiver senses the vibration generated in the transmitter and changes it into an electric signal. The controller controls the operations of the transmitter and the receiver and contact of the transmitter and the receiver with the cutting edge. The signal generator generates an electric signal with amplitude and frequency corresponding to a vibration signal and outputs the electric signal to the transmitter. The detector collects electric signals output from the receiver and carries out noise removal and amplification. The data analyzer compares electric signal data corresponding to previously stored vibration signals and analyzes the replacement period of the cutting blade.