| 摘要 |
<p>A modified epoxy resin which exhibits excellent handleability in a solid state at ordinary temperatures and exerts an excellently low viscosity at a molding temperature; epoxy resin compositions which each comprise the modified epoxy resin and an inorganic filler and which can give cured articles exhibiting high thermal conductivity, low thermal expansion, and excellent heat resistance and moisture resistance; and cured epoxy resin articles made by using the compositions. The modified epoxy resin can be prepared by reacting a mixture of hydroquinone and 4, 4'-dihydroxybiphenyl at a weight ratio of 0.1 to 10.0 with epichlorohydrin, and is in a crystalline state at ordinary temperatures. The epoxy resin compositions each comprises (A) an epoxy resin component, (B) a curing agent, and (C) an inorganic filler as the main components, with the epoxy resin component (A) containing the modified epoxy resin in an amount of 50wt% or above.</p> |
