| 发明名称 |
LIGHT EMITTING DIODE PACKAGE, AND BACKLIGHT UNIT AND DISPLAY DEVICE USING THE SAME |
| 摘要 |
A light emitting diode package may be provided that includes a light emitting diode chip and a heat sink. Heat generated from the light emitting diode chip may be radiated to the outside using the heat sink. |
| 申请公布号 |
WO2010147290(A1) |
申请公布日期 |
2010.12.23 |
| 申请号 |
WO2010KR01492 |
申请日期 |
2010.03.10 |
| 申请人 |
LG ELECTRONICS INC.;SEO, BU WAN |
发明人 |
SEO, BU WAN |
| 分类号 |
H01L33/64 |
主分类号 |
H01L33/64 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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