WAFER PROCESSING SHEET

摘要

The present invention relates to a wafer processing sheet. The present invention provides a wafer processing sheet which is excellent in heat resistance and dimensional stability, and which has superior stress relaxation property to prevent a wafer from being damaged or delimited by residual stresses or a non-uniform pressure, and which has superior cutting property. In addition, the present invention provides a sheet which can effectively suppress a blocking phenomenon during a wafer processing process or the like. Consequently, a base of the present invention can be valuably used as a processing sheet in a variety of wafer processing processes including dicing, back grinding, picking-up and so on.