An LED array is mounted on a base that is thermally coupled to a heat spreader. At least one aperture is provided between the support area and an edge of the heat spreader. The heat spreader may be coupled to a thermal pad which has sufficient thermal conductivity and is sufficiently thin to allow the thermal resistivity between the heat spreader and a corresponding heat sink to be below a predetermined value.
申请公布号
WO2010107781(A3)
申请公布日期
2010.12.23
申请号
WO2010US27463
申请日期
2010.03.16
申请人
MOLEX INCORPORATED;ZADEREJ, VICTOR;MCGOWAN, DANIEL B.;PICINI, MICHAEL C.
发明人
ZADEREJ, VICTOR;MCGOWAN, DANIEL B.;PICINI, MICHAEL C.