| 摘要 |
A method for generating a service action for a computer system is described. During the method, a longevity index value for a packaging technology (such as solder joints in a BGA) in the computer system is calculated using thermal and vibration telemetry data (which is collected in the computer system) and a longevity model. This longevity model may be based on accelerated failure testing of the packaging technology, field failures of the packaging technology in a group of computer systems (which includes the computer system) and/or thermal and vibration telemetry data for the group of computer systems. Furthermore, using the longevity index value, the service action for the computer system is determined. Based on the longevity index value, remedial action (such as repairs to the computer system) may be scheduled and performed.
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