发明名称 PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED WATCH
摘要 The piezoelectric vibrator manufacturing method of the invention is a method for manufacturing a plurality of piezoelectric vibrators in which a piezo-electric vibration member is sealed up in a cavity formed between a base substrate and a lid substrate bonded to each other, all at once by utilizing a base substrate wafer and a lid substrate wafer, and the method comprises a recess forming step of forming, in the lid substrate wafer, a plurality of cavity recesses for forming cavities when the two wafers are overlaid; a through-electrode forming step of forming a plurality of through-electrodes in and through the base substrate wafer; a routing electrode forming step of forming a plurality of routing electrodes connected electrically with the through-electrodes, on the upper face of the base substrate wafer; a mounting step of bonding the plural piezoelectric vibration members to the upper face of the base substrate wafer via the routing electrodes; an overlaying step of overlaying the base substrate wafer and the lid substrate wafer thereby to house the piezoelectric vibration members in the cavities surrounded by the recesses and the two wafers; a bonding step of bonding the base substrate wafer and the lid substrate wafer thereby to seal up the piezoelectric vibration members in the cavities; an external electrode forming step of forming a plurality of external electrodes connected electrically with the through-electrodes, on the lower face of the base substrate wafer; and a cutting step of cutting the two bonded wafers thereby to shred them into the plural piezoelectric vibrators. The through-electrode forming step includes a through-hole forming step of forming a plurality of through-holes in and through the base substrate wafer; a setting step of disposing electroconductive core members which are formed to have two flat ends and a thickness substantially equal to that of the base substrate wafer, in those plural through-holes, and disposing connection members between the core mem-bers and the through-holes; and a firing step of firing the connection members at a predetermined temperature to thereby integrally fix the through-hole, the connection member and the core member to each other.
申请公布号 US2010320877(A1) 申请公布日期 2010.12.23
申请号 US20100852001 申请日期 2010.08.06
申请人 ONITSUKA OSAMU;SUGAMA KAZUYOSHI 发明人 ONITSUKA OSAMU;SUGAMA KAZUYOSHI
分类号 H01L41/047;H01L41/22 主分类号 H01L41/047
代理机构 代理人
主权项
地址
您可能感兴趣的专利