发明名称 METAL OXIDE FILM FORMATION METHOD AND APPARATUS
摘要 [Problems] There is provided a metal oxide film forming method capable of controlling a film thickness of a metal oxide even if the metal oxide is subject to a self-limited thickness. [Means for Solving the Problems] A metal oxide film forming method includes a process (1) of supplying a metal source gas to a surface of a base before a temperature of the base reaches a film formation temperature of a metal oxide film; and a process (2) of setting the temperature of the base to be equal to or higher than the film formation temperature and forming the metal oxide film on the base by making a reaction between the metal source gas supplied to the surface of the base and residual moisture on the surface of the base.
申请公布号 US2010323512(A1) 申请公布日期 2010.12.23
申请号 US20100781934 申请日期 2010.05.18
申请人 TOKYO ELECTRON LIMITED 发明人 MATSUMOTO KENJI;MIYOSHI HIDENORI;ITOH HITOSHI;SATO HIROSHI
分类号 H01L21/3205 主分类号 H01L21/3205
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