| 摘要 |
PURPOSE: A conductive film is provided to improve the coating adhesive force and uniformity with a base material by using a dry plating process and a wet plating process. CONSTITUTION: A non-conductive thin film base material(10) has the thickness of 1um to 50um. A first plating layer(20A,20B) is formed in both sides of the non-conductive thin film base material. The first plating layer is formed by plating a first metal. A second plating layer(30A,30B) is formed on the first plating layer. The second plating layer is formed by plating a second metal through a wet plating process. A third plating layer(40A,40B) is formed on the second plating layer. The third plating layer is formed by plating a third metal through the wet plating process.
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