发明名称 TEST CONTACT ARRANGEMENT
摘要 <p>The invention relates to a test contact arrangement (15) for testing semiconductor components, comprising at least one test contact (10) which is arranged in a test contact frame (13) and is designed in the type of a cantilever arm and which has a fastening base (12) and a contact arm (30) which is provided with a contact tip (11) and which is connected to the fastening base, wherein the fastening base is inserted with a fastening projection (16) thereof into a frame opening (14) of the test contact frame in such a manner that a lower edge (17) of the fastening projection is essentially aligned flush with a lower side (18) of the test contact frame.</p>
申请公布号 EP2263094(A2) 申请公布日期 2010.12.22
申请号 EP20090725107 申请日期 2009.03.27
申请人 PAC TECH - PACKAGING TECHNOLOGIES GMBH 发明人 AZDASHT, GHASSEM
分类号 G01R1/073;G01R1/067 主分类号 G01R1/073
代理机构 代理人
主权项
地址