| 摘要 |
<p>Provided is a low-temperature fired ceramic circuit board formed by subjecting a conductor paste and a green sheet to simultaneous firing at 800 to 900 °C, in which: the green sheet contains a glass powder which contains 35 to 39 % by weight of SiO 2 , 9 to 17 % by weight of Al 2 O 3 , 21 to 40 % by weight of B 2 O 3 , 10 to 20 % by weight of R'O (where R' represents at least one kind selected from the group consisting of Mg, Ca, and Ba), 0.2 to 2 % by weight of Li 2 O, and 0.5 to 2 % by weight of MO 2 (where M represents at least one kind selected from the group consisting of Ti and Zr), and an alumina powder at a weight ratio of the glass powder to the alumina powder of 4:6 to 6:4; and the conductor paste contains Ag-containing metal particles, a binder component, and a heat decomposable alkali metal compound, and the content of the heat decomposable alkali metal compound is such that 0.13 to 7.8 alkali metal atoms are contained for each 100 metal atoms in the metal particles. A low-temperature fired ceramic circuit board is provided that: can be fired at 900 °C or lower; has a small degree of board warpage and conductor wrinkles when simultaneous firing is performed with an Ag-based conductor paste; has low hygroscopicity; with excellent dielectric properties in high-frequency bands (microwave and millimeter-wave bands); and has a flat circuit surface free from coming up of a glass component.</p> |
