| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board wherein a water system process is used to stably form a wiring structural body on a supporting substrate, and the wiring structural body can be easily peeled off from the supporting substrate. <P>SOLUTION: The wiring board 10 includes a supporting substrate 11 and a wiring structural body 17 which is arranged on the supporting substrate 11 with an adhesion layer 24 in-between. The adhesion layer 24 is comprised of a first layer 12 made of a water-soluble material, and a second layer 13 which is formed so as to cover the entire surface of the first layer 12 and is made of a waterproof material. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
