Method for manufacturing camera modules and substrate comprising a plurality of camera integrated circuit chips

摘要

The present invention is directed at a method for manufacturing camera modules, said method comprising the steps of providing a substrate including a plurality of printed circuit boards; affixing a plurality of camera integrated circuit chips to said substrate, each of said camera integrated circuit chips affixed on a respective one of said plurality of printed circuit boards; and forming a plurality of moldings on said substrate, each of said moldings formed on a respective one of said plurality of printed circuit boards and on said respective one of said camera integrated circuit chips. Further, the present invention is directed at a substrate comprising: a plurality of printed circuit boards; a plurality of camera integrated circuit chips, each of said plurality of camera integrated circuit chips affixed to a respective one of said plurality of printed circuit boards; and a plurality of moldings, each of said plurality of moldings formed over a respective one of said plurality of printed circuit boards and said respective camera integrated circuit chip.