| 摘要 |
A semiconductor module including multiple semiconductor devices prevents a signal that flows through a bonding wire connected to one semiconductor device from acting as noise which affects the other semiconductor devices, thereby improving the operation reliability of the semiconductor module. A second semiconductor device layered on a first semiconductor device includes a current output electrode via which large current is output. The current output electrode is electrically connected to a substrate electrode provided to a first wiring layer via a bonding wire. The bonding wire is provided across the side E1 of the second semiconductor device. A bonding wire connected to the first semiconductor device is provided across a side of the first semiconductor device other than the side F1 that corresponds to the side E1 of the second semiconductor device, i.e., across the side F2, F3, or F4 of the first semiconductor device. |
