发明名称 METHOD FOR THE ELECTROCHEMICAL COATING OF A SUBSTRATE BY BRUSH PLATING AND DEVICE FOR CARRYING OUT SAID METHOD
摘要 A method for the electrochemical coating of a substrate uses brush plating. This is to take place with an electrolyte in that particles are dispersed, which are embedded into the developing layer. It is proposed to add the particles to the carrier for the electrolyte by way of a separate conduit system. The electrolyte is added by way of a conduit system. In this way it is achieved that an agglomeration of the particles in the electrolyte can be prevented because only a short time passes between when the particles are fed and the layer is formed. A device for electrochemical coating has two conduit systems provided for this purpose.
申请公布号 EP2262929(A2) 申请公布日期 2010.12.22
申请号 EP20090733640 申请日期 2009.04.01
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 HEINRICHSDORFF, FRANK;JENSEN, JENS DAHL;KRETSCHMER, HANS-RICHARD;REZNIK, DANIEL;STECKENBORN, ARNO
分类号 C25D5/06;C25D5/20;C25D15/00 主分类号 C25D5/06
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