发明名称 |
Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers |
摘要 |
A method (and structure) of making an electronic interconnection, includes, for a signal line to be interconnected, using a plurality of bonding wires configured to provide a controlled impedance effect. |
申请公布号 |
US7854368(B2) |
申请公布日期 |
2010.12.21 |
申请号 |
US20070923413 |
申请日期 |
2007.10.24 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
KWARK YOUNG HOON;SCHUSTER CHRISTIAN |
分类号 |
B23K31/02;H01L23/66;H05K1/02 |
主分类号 |
B23K31/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|