| 摘要 |
<p>Disclosed is a novel photosensitive resin composition having positive lithographic properties, which has excellent storage stability, while exhibiting high sensitivity and excellent long-term stability of sensitivity after exposure. A method for producing a cured relief pattern using the composition and a semiconductor device having the cured relief pattern are also disclosed. The photosensitive resin composition is characterized by containing (A) 100 parts by mass of a hydroxypolyamide containing a structure represented by general formula (1) (wherein X1, X2, Y1, Y2, l and m are as defined in claims), (B) 0.01-30 parts by mass of an alkoxyalkyl group-containing compound represented by general formula (2) (wherein k, X, R1, R2, n, p and q are as defined in claims), and (C) 1-100 parts by mass of a diazoquinone compound.</p> |
