发明名称 |
Corrosion inhibitor additives to prevent semiconductor device bond-pad corrosion during wafer dicing operations |
摘要 |
An improved method of dicing a semiconductor wafer which substantially reduces or eliminates corrosion of copper-containing, aluminum bonding pads. The method involves continuously contacting the bonding pads with deionized water and an effective amount of a copper corrosion inhibiting agent, most preferably benzotriazole. Also disclosed, is an improved apparatus for dicing a wafer, in which a copper corrosion inhibiting agent is included in the cooling system for cooling the dicing blade.
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申请公布号 |
US7855130(B2) |
申请公布日期 |
2010.12.21 |
申请号 |
US20030249576 |
申请日期 |
2003.04.21 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CADIEUX ROBERT R;ESTES SCOTT A;KRYWANCZYK TIMOTHY C |
分类号 |
H01L21/78;B28D5/00;B28D5/02;H01L21/301;H01L21/46 |
主分类号 |
H01L21/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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