发明名称 Gap filling method and method for forming semiconductor memory device using the same
摘要 A gap filling method and a method for forming a memory device, including forming an insulating layer on a substrate, forming a gap region in the insulating layer, and repeatedly forming a phase change material layer and etching the phase change material layer to form a phase change material layer pattern in the gap region.
申请公布号 US7855145(B2) 申请公布日期 2010.12.21
申请号 US20070783975 申请日期 2007.04.13
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE JIN-IL;LEE CHOONG-MAN;CHO SUNG-LAE;LIM SANG-WOOK;PARK HYE-YOUNG;PARK YOUNG-LIM
分类号 H01L21/44 主分类号 H01L21/44
代理机构 代理人
主权项
地址