发明名称 |
Wirebond structure and method to connect to a microelectronic die |
摘要 |
A wirebond structure includes a copper pad formed on or in a surface of a microelectronic die. A conductive layer is included in contact with the copper pad and a bond wire is bonded to the conductive layer. The conductive layer is formed of a material to provide a stable contact between the bond wire and the copper pad in at least one of an oxidizing environment and an environment with temperatures up to at least about 350° C.
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申请公布号 |
US7855103(B2) |
申请公布日期 |
2010.12.21 |
申请号 |
US20080127584 |
申请日期 |
2008.05.27 |
申请人 |
INTEL CORPORATION |
发明人 |
GLEIXNER ROBERT J.;DANIELSON DONALD;PALUDA PATRICK M.;NAIK RAJAN |
分类号 |
H01L21/50;H01L21/44;H01L21/461;H01L21/48;H01L21/603;H01L23/485 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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