发明名称 |
Inter-transmission multi memory chip, system including the same and associated method |
摘要 |
A multi memory chip stacked on a multi core CPU includes a plurality of memories, each memory corresponding to a CPU core from among the CPU cores and being configured to directly transmit data between the other memories of the multi memory chip.
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申请公布号 |
US7855925(B2) |
申请公布日期 |
2010.12.21 |
申请号 |
US20080071745 |
申请日期 |
2008.02.26 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KANG UK-SONG;LEE JUNG-BAE |
分类号 |
G11C7/10 |
主分类号 |
G11C7/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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