发明名称 Inter-transmission multi memory chip, system including the same and associated method
摘要 A multi memory chip stacked on a multi core CPU includes a plurality of memories, each memory corresponding to a CPU core from among the CPU cores and being configured to directly transmit data between the other memories of the multi memory chip.
申请公布号 US7855925(B2) 申请公布日期 2010.12.21
申请号 US20080071745 申请日期 2008.02.26
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KANG UK-SONG;LEE JUNG-BAE
分类号 G11C7/10 主分类号 G11C7/10
代理机构 代理人
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