SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor device and a manufacturing method thereof are provided to improve the degree of freedom of a semiconductor package in a MCM type semiconductor device. CONSTITUTION: A conductive member(3B) is electrically connected to the main side of a wiring board(2C). A semiconductor chip(22), which is loaded in the wiring board of a lower layer, is a SOC chip and executes a logical process like an image process. A first conductive member is formed on a second electrode pad. A conductive layer is formed on the surface of the first conductive member.