| 摘要 |
PURPOSE: An electronic device package and a manufacturing method thereof are provided to use two sides patterning process in order to supply separated metal layers which have bonding locations which are separated by an insulating layer. CONSTITUTION: A first side surface in a metal layer is coated to a first insulation layer(110). A second side in the opposite side of the metal layer is coated to a second insulation layer(115). The first insulation layer is patterned in order to expose bonding locations in the first side surface of the metal layer. The second insulation layer is patterned so that the remaining parts in the second insulation layer are directly arranged to face the bonding locations of the first side surface(125). |
