| 摘要 |
<p>PURPOSE: A method for manufacturing a semiconductor package is provided to manufacture semiconductor package as each unit scale using an adhesive unit and a mold of a discrete molding method. CONSTITUTION: A carrier(10) has an area for forming semiconductor package areas. A, adhesive unit(12) such as UV adhesive is attached to the upper surface of the carrier. Chip mounting plates(14) are attached to the surface of the adhesive unit. Leads(16) are positioned near the rhombic edge of the chip mounting plate. A groove(18) is formed on the side of the chip mounting plate and the lead. The groove is filled with compound resin(20). One semiconductor package area is formed on the surface of the adhesive unit. The semiconductor chip(24) is attached on the chip mounting plate.</p> |
