| 摘要 |
PURPOSE: A method for manufacturing a wiring board is provided to improve degree of freedom in a mounting process by controlling a connection height of various components by the amount of soldering for a mounting process. CONSTITUTION: A first resist layer with a first opening unit is formed on a first surface of a support plate(1). A first plating layer(4) is formed on the opening unit of the first resist layer with an electrolytic plating method. A second resist layer with an opening unit is formed on a second surface of a support plate. A second plating layer(6) is formed on the opening unit by the electrolytic plating method. A wiring layer(11,12,13) electrically connected to the first and second plating layers and an insulation layer(14,15,16) are formed. The support plate is removed. |
