发明名称 STICKING METHOD AND STICKING APPARATUS
摘要 PURPOSE: A method and a sticking device thereof are provided to stick a support plate to a substrate by preventing each adhesive layer from being mixed and sunken and simply and rapidly foliating it. CONSTITUTION: A first glue layer(4) is formed on a substrate. An isolation film layer is formed on the first glue layer. A second glue layer(6) has a faster dissolution speed than the first glue layer. The second glue layer is dissolved in a different solvent in which the first glue layer is dissolved.
申请公布号 KR20100133305(A) 申请公布日期 2010.12.21
申请号 KR20100053812 申请日期 2010.06.08
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 IMAI HIROFUMI;TAMURA KOKI;ASAI TAKAHIRO;YOSHIOKA TAKAHIRO;INAO YOSHIHIRO
分类号 H01L21/304;C09J11/00 主分类号 H01L21/304
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