PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to improve a heat radiation effect by electroplating with copper to maximize the heat radiation surface. CONSTITUTION: A seed layer(110) is formed on the surface of an insulation substrate(100). The patterned first plating resist is formed on the surface of the seed layer. A connection pad(130) and a dummy pad(135) are formed by electroplating. A second plating resist(140) is formed to selectively expose the surface of a dummy pad. A first radiation pattern(151) is formed on the surface of a dummy pad by the electroplating. The seed layer exposed by the flash etching is removed.