| 摘要 |
PURPOSE: A manufacturing method is provided to have a high reliability stack via by minimizing the resistance of a signal transmission. CONSTITUTION: At least one inner layer, which has a bump implemented through an ink jetting method, is formed on the bump pad of a copper foil composite. An outermost base layer having a filling bump is formed through a via hole filling process. The process forming the inner layer comprises a step of forming a bump on a mask through the ink jetting process. A process forming the inner layer comprises a step of forming an insulating layer on the bump. The inner layer forming process repeats at least one time. The inner layer forming process comprises a step of forming a bump pad through a surface process and a pattering process on the bump.
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