| 摘要 |
PURPOSE: An apparatus for guiding a thin-film type plating target in a plating system is provided to allow a plating target to shake only in a space formed by wires. CONSTITUTION: An apparatus for guiding a thin-film type plating target in a plating system comprises an entrance fixing part(3), an exit fixing part(5), the middle fixing part(37), and a plurality of non-conductive wires(7). The entrance fixing part is fixed to the inner side of a plating bath where a plating target(P) is drawn in. The exit fixing part is fixed to the inner side of the plating bath where the plating target is drawn out. The middle fixing part is installed between the entrance fixing part and the exit fixing part. One end of each non-conductive wire is fixed to the entrance fixing part or the exit fixing part while the other end is fixed to the middle fixing part. The non-conductive wires form a narrow long passage in the vertical direction, through which the plating target is guided and transferred.
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