| 摘要 |
PURPOSE: A manufacturing method is provided to form a horizontal cross section into a rectangular shape by forming the stack via structure of an inner substrate into a bump structure. CONSTITUTION: At least one inner layer having a bump is formed on a carrier layer. The outermost base layer having a filling bump is formed in the outer part of an inner layer. A process of forming the inner layer comprises a step of forming a plating layer and a bump pad formed as a Cu layer on a metal carrier layer. A process of forming the inner layer comprises a step of forming the bump on the bump pad. The plating layer is formed by using one selected among ni, cr, au, ag, pb, and pd.
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