PB-FREE SOLDER ALLOY COMPOSITIONS COMPRISING ESSENTIALLY TIN (SN), SILVER (AG), COPPER (CU), AND PHOSPHORUS (P),申请号HK20070100771-传众专利搜索

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发明名称	PB-FREE SOLDER ALLOY COMPOSITIONS COMPRISING ESSENTIALLY TIN (SN), SILVER (AG), COPPER (CU), AND PHOSPHORUS (P)
摘要
申请公布号	HK1094685(A1)	申请公布日期	2010.12.17
申请号	HK20070100771	申请日期	2007.01.22
申请人	AOKI LABORATORIES LTD.	发明人	LEUGN, WAI YIN DAVID
分类号	B23K;C22C	主分类号	B23K
代理机构		代理人
主权项
地址

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