发明名称 SOLUBLE PLUG
摘要 PROBLEM TO BE SOLVED: To provide a soluble plug having excellent creep characteristics in a 58-65°C temperature range without including hazardous substances such as lead. SOLUTION: In the soluble plugs 1, 11, a solder alloy 3 having a composition of 1.5-2.5 mass% of silver, 33-35 mass% of bismuth and 63-65 mass% of indium is filled in a through-hole in a plug-shaped body 2. Even if disposed, the soluble plugs may not cause the contamination of underground water etc., and can achieve excellent creep characteristics in the 58-65°C temperature range. Before the inside of a device reaches a predetermined temperature and the soluble plugs are operated, the solder alloy is not pushed out due to pressure in the device. Preferably, the solder alloy is filled in the through-hole having 4-7 mm of an inner diameter and 25 mm or larger of an overall axial length in the body. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010281463(A) 申请公布日期 2010.12.16
申请号 JP20090132678 申请日期 2009.06.02
申请人 FUJI KOKI CORP 发明人 HOSOKAWA KOJI
分类号 F25B49/02;F16J13/24 主分类号 F25B49/02
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