| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing apparatus for a substrate, capable of simultaneously cleaning the lower and the upper surfaces of a semiconductor wafer, and moreover, without fail. SOLUTION: A substrate processing apparatus includes a processing tank 1 in which an in/out port 2 is formed on one side surface thereof; a holding/driving means 8 provided within the processing tank in a position facing the in/out port for holding both ends of a semiconductor wafer 10 conveyed into the processing tank, the ends being in a radial direction perpendicular to the conveying direction of the semiconductor wafer, and driving to rotate the semiconductor wafer; cleaning nozzles 124 and 125, that supply processing liquid to the semiconductor wafer held by the holding/driving means; arms 63 and 121, that are provided further inward within the processing tank than the holding/driving means and have cleaning brushes 71 and 122 at the tips for cleaning the surfaces of the semiconductor wafer; and tool units 61 and 62, that have a driving means for driving the arms in the vertical direction and driving the arms to swing such that the cleaning brushes move along the radial direction of the semiconductor wafer. COPYRIGHT: (C)2011,JPO&INPIT
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