| 摘要 |
Disclosed is a high-frequency switch module which achieves a reduction in characteristic variations in an input/output shared terminal part of a high-frequency switch. Specifically provided is a high-frequency switch module (201) configured by mounting a high-frequency switch (100) and SAW filters (F1-F4) on the upper surface of a multilayer substrate (101). A plurality of high-frequency terminals, a common terminal, control terminals, and a power supply terminal of the high-frequency switch (100) are formed on the lower surface of a semiconductor substrate. Input/output shared terminals (U1, U2, U3) among the high-frequency terminals are disposed along one side of the semiconductor substrate. Input/output shared external electrodes (UMTS1, UMTS2, UMTS3) that are in continuity with input/output shared internal electrodes to which the input/output shared terminals (U1, U2, U3) are connected are formed along one side of the multilayer substrate (101). |
