| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device having a structure which can relive the damage that acts on a semiconductor element, when performing flip-chip bonding of a semiconductor to a wiring board. <P>SOLUTION: A semiconductor element (1) includes a component (4), which is mounted separately from a first electrode (2) on the same surface as a surface on which the first electrode (2) is arranged and a dummy electrode (5), mounted between the first electrode (2) and the component (4) on the same surface as a surface on which the first electrode (2) is arranged. A support body (6) for correcting the inclination of the semiconductor element (1), relative to a wiring board (7) at the time of the flip-chip bonding of the semiconductor element (1) to the wiring board (7), is interposed between the dummy electrode (5) and the wiring board (7). <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
