| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device that is less expensive as compared with the conventional one with conventional and unexceptional module constitution, and secures bonding reliability of a solder bonding part. <P>SOLUTION: The semiconductor device includes a circuit board P formed by bonding metal plates M1, M2 to both surfaces of an insulating substrate, at least one semiconductor element S, S' bonded to the external surface of one metal plate M1 via first solder H1, and a base plate B for heat dissipation bonded to the external surface of the other metal plate M2 via second solder H2. The first solder and second solder are made of solder materials of the same kind, and the ratio (a) of the sum t<SB>M</SB>of plate thicknesses of both the metal plates M1, M2 to the plate thickness t<SB>C</SB>of the insulating substrate C is set to a range of 1.5 to 5.5 so as to secure durability of the solder H1 and solder H2 to temperature stress. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
