| 摘要 |
PROBLEM TO BE SOLVED: To provide a pressure sensor module whose size is reduced to a chip size, in the pressure sensor module including an integrated circuit for controlling a pressure sensor. SOLUTION: The pressure sensor module 20A(20) includes: the pressure sensor 10A(10) including at least a base body 2 which is made by stacking a first substrate 3 on a second substrate 4, a space part 5 disposed inside the second substrate in the stacking surface in the base body at the center area, a diaphragm part 6 located above the space part and comprising a thinned area of the first substrate, a pressure-sensitive element 7 disposed at the diaphragm part, and a conductive part 8 disposed in the periphery area of the first substrate excluding the diaphragm part and electrically connected to the pressure-sensitive element; and an integrated circuit for controlling the pressure sensor, disposed on one surface of the base body comprising the outer surface of the second substrate. COPYRIGHT: (C)2011,JPO&INPIT
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