发明名称 |
PRINTED CIRCUIT BOARD, SEMICONDUCTOR DEVICE COMPRISING THE SAME, AND METHOD OF MANUFACTURING THE SAME |
摘要 |
Disclosed is a printed circuit board, which includes a first circuit layer embedded in one surface an insulating layer and including a bump pad and a wire bonding pad, thus realizing a high-density wire bonding pad. A semiconductor device including the printed circuit board and a method of manufacturing the printed circuit board are also provided.
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申请公布号 |
US2010314755(A1) |
申请公布日期 |
2010.12.16 |
申请号 |
US20090511723 |
申请日期 |
2009.07.29 |
申请人 |
KANG MYUNG SAM;HWANG MI SUN;KIM OK TAE;KANG SEON HA;SHIN GIL YONG;YUN KIL YONG;CHO MIN JUNG |
发明人 |
KANG MYUNG SAM;HWANG MI SUN;KIM OK TAE;KANG SEON HA;SHIN GIL YONG;YUN KIL YONG;CHO MIN JUNG |
分类号 |
H01L23/498;B05D5/12;B32B38/00;H05K1/11 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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