Metal reduction in wafer scribe area,申请号KR20057013873-传众专利搜索

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发明名称	Metal reduction in wafer scribe area
摘要
申请公布号	KR101001530(B1)	申请公布日期	2010.12.16
申请号	KR20057013873	申请日期	2004.01.23
申请人		发明人
分类号	H01L21/301;H01L;H01L21/20;H01L21/304;H01L21/3213;H01L21/78	主分类号	H01L21/301
代理机构		代理人
主权项
地址

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