| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition for sealing an optical semiconductor element, improved of curing rate or the like and formable of a sealed product with high hardness, excellent in light resistance and heat shock resistance, especially excellent in thermal discoloration resistance. <P>SOLUTION: This composition includes (A) a first silicone resin having an epoxy group-containing non-aromatic group and a linear diorganopolysiloxane segment, (B) a second silicone resin having an epoxy group-containing non-aromatic group and diorganosiloxane units, (C) a curing agent and (D) a curing catalyst. The composition excels in curability, and the obtained cured product excels in heat discoloring resistance. <P>COPYRIGHT: (C)2011,JPO&INPIT |
