| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To shorten the machining time by a laser beam as much as possible. <P>SOLUTION: In performing laser beam machining on glass substrates successively transported from a film depositing device which forms a transparent electrode layer, a semiconductor layer or a metallic layer on the glass substrate, the glass substrate is subjected to alignment processing and then held and moved. A stage for the alignment processing and a stage for holding and moving the glass substrate are installed in two places on both sides of a laser beam machining stage. As a result, while a laser beam machining is performed on one stage, an alignment processing is performed on the other stage, greatly shortening a waiting time. In addition, when one of the stages fails due to fault or the like, laser beam machining is maintained by using the other stage. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
