| 摘要 |
PROBLEM TO BE SOLVED: To provide a fine pattern having an excellent conductive characteristic. SOLUTION: An applied layer 12 is formed by applying a liquid dispersion 8 dispersed with a micro-order of copper particles 2 each having an oxide film 4 into a solvent 6, onto a substrate 10. The solvent 6 is vaporized from the applied layer 12. An applied layer 14 is irradiated with hydrogen radicals, to remove the oxide films 4 of the copper particles 2 in the applied layer 14. The substrate 10 is temperature-elevated to flocculate the copper particles. COPYRIGHT: (C)2011,JPO&INPIT
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