| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board with greater adhesive strength, and to provide a method of manufacturing the same. <P>SOLUTION: The method of manufacturing the wiring board includes: an arranging step of arranging a second land pattern 422, a flexible film 404, and a carrier 402 so that a projecting part 407b of conductive paste and the second land pattern 422 face each other, and a projection part 407a of the conductive paste and a first land pattern 412 face each other; a pressurizing step of pressurizing the arranged second wiring board 421, flexible film 404, and carrier 402 so that the first land pattern 412 is pressed by the conductive paste 407 and intrudes to a carrier 402 side to form a bump electrode 413. In the pressurizing process, a recessed part 413a is formed on a through-hole side of the bump electrode 413, a protruded part 413b is formed on the opposite side thereof, and the conductive paste 407 enters the recessed part 413a. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
