发明名称 METHOD FOR MEASURING PLATING FILM THICKNESS OF STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a method for measuring a plating film thickness of a structure capable of eliminating the deviation of a measurement value from an actual status by appropriately measuring a plating film thickness of a structure such as a steel tower, and formulating an appropriate painting plan in order to equalize painting work. SOLUTION: The method includes an underlayer treatment step of polishing a measuring surface (side surface 3a) of a nut 3 used for the structure, an effective measurement value sorting step of measuring the film thickness of a prescribed region of the measuring surface of the nut 3 by the predetermined number of times by an electromagnetic film thickness meter and eliminating measurement values exceeding a predetermined upper-limit value to sort effective measurement values, a measurement value correction step of correcting the effective measurement values sorted in the effective measurement value sorting step according to the nominal designation of threads of the nut and whether the nut should be disassembled, and a measurement value averaging step of calculating an average value of the effective measurement values corrected in the measurement value correction step. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010281740(A) 申请公布日期 2010.12.16
申请号 JP20090136509 申请日期 2009.06.05
申请人 CHUGOKU ELECTRIC POWER CO INC:THE;CHUDEN KOGYO KK 发明人 UEJI MINORU;INOUE YOSHIAKI
分类号 G01B7/06;C23C2/06 主分类号 G01B7/06
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