FILM-LIKE ADHESIVE AND FILM-LIKE ANISOTROPICALLY CONDUCTIVE ADHESIVE

摘要

PROBLEM TO BE SOLVED: To provide a film-like adhesive without requiring advanced dispersion technique in a production step, without requiring great effect for quality control, and effectively suppressing generation of voids. SOLUTION: This film-like adhesive includes a phenoxy resin having a molecular weight of≥10,000; a first epoxy resin comprising a radical polymerization product produced by radical polymerization of acrylic monomer containing an epoxy group; a latent curing agent; and a second epoxy resin having a reactivity with the latent curing agent. COPYRIGHT: (C)2011,JPO&INPIT