| 摘要 |
PROBLEM TO BE SOLVED: To provide a film-like adhesive without requiring advanced dispersion technique in a production step, without requiring great effect for quality control, and effectively suppressing generation of voids. SOLUTION: This film-like adhesive includes: a phenoxy resin having a molecular weight of≥10,000; a first epoxy resin comprising a product produced by a first epoxy resin curing agent having 2 or more groups which may be at least one selected from amino, mercapto, carboxyl, and hydroxyl of a first epoxy resin; a latent curing agent; and a second epoxy resin having a reactivity with the latent curing agent. COPYRIGHT: (C)2011,JPO&INPIT
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