发明名称 METHOD FOR FORMING ELECTRODE PATTERN OF CERAMIC SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a method for forming an electrode pattern of a ceramic substrate. SOLUTION: The method for forming an electrode pattern includes the steps of: forming a plurality of conductive adhesion patterns 110 on a ceramic substrate 100 to be separated apart from one another; forming a plating seed layer 120 covering the conductive adhesion patterns 110, on the ceramic substrate 100; forming photoresist patterns exposing parts corresponding to the conductive adhesion patterns 110, on the plating seed layer 120; forming a plating layer 140 on the plating seed layer 120 exposed by the photoresist patterns; removing the photoresist patterns 130a; and etching parts of the plating seed layer 120 exposed by removal of the photoresist patterns. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010283318(A) 申请公布日期 2010.12.16
申请号 JP20090180968 申请日期 2009.08.03
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 YOO WON HEE;BYEUNG GYU CHANG;KIM YONG SUK
分类号 H05K3/18 主分类号 H05K3/18
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