INSULATING RESIN FILM, BONDED BODY USING INSULATING RESIN FILM, AND METHOD FOR MANUFACTURING BONDED BODY

摘要

Provided is an insulating resin film which bonds together a substrate and an electronic component. The insulating resin film has a first adhesive layer disposed on the substrate side, and a second adhesive layer disposed on the electronic component side. The first adhesive layer and the second adhesive layer contain an inorganic filling material, the peak temperature of DSC heat generation of the second adhesive layer is higher than that of DSC heat generation of the first adhesive layer, and the thickness of the first adhesive layer is 50-90% of the total thickness.